The Restaurant Store - Kitchen Equipment and Utensils

With full grip front and rear aluminum carrying handles and slick feet, the system can be moved to a new location or to gain better access. The system can be used in desktop/deskside orientations or rack-mounted using HP's enterprise-class, fully extendable rails.

The interior is organized with a consistent user access strategy. All user-serviceable components are identified with blue touchpoints. The service label located on the left access panel provides users with system board and memory loading information and quick access to diagnostic information. Cables are hidden or efficiently routed, providing better component access and airflow management.

The chassis is designed to maximize fresh air inlet to the system, and direct cool air where it's needed. The CPU and memory ducting has a design to help maximize fresh air inlet to both the memory and CPU, and keeps the memory airflow separated from the CPU airflow. The memory ducting has a patent-pending multi-channel design that directs cooler air from the inlet to both the front and rear DIMM banks, as well as to separate segments along the length of the DIMMs. The zone between the front and rear CPUs is divided by a baffle to direct fresh air to both CPUs and prevent preheated exhaust air from the front CPU cooler from entering the rear CPU cooler.

Due to the tool-free ease of use, HP understands system and component security may be a concern. Therefore, several security features have been incorporated. The left side access panel includes a key lock and the right side panel can be secured with the HP BPC Security Lock or Kensington security device. An optional system intrusion switch is also available. The rear access power supply is unlocked by default but can be secured by removing the PSU and enabling the locking mechanism on the side cover of the power supply.

The HP Z8 G4 supports up to 768GB using RDIMM modules (8, 16, and 32GB), and up to 3TB using LRDIMM modules (64, 128, and 256GB). While the system has 24 total RAM slots, all 24 slots are only supported in systems with dual processors. Systems with single processors only support 12 RAM slots. Additionally, the system will only work with DDR4 memory, you cannot mix LRDIMMs with RDIMMs, and dual processor configurations with memory modules installed for only one processor is not supported.

Seven PCIe Gen3 slots provide expandability supporting up to four PCIe storage devices with optional slots, including Thunderbolt 3 cards and RAID controllers.

Slot 1
PCIe Gen3 x4 (transforms to PCIe Gen3 x8 when a second CPU is installed)

Slot 2
PCIe Gen3 x16

Slot 3
PCIe Gen3 x16 (available only when a second CPU is installed)

Slot 4
PCIe Gen3 x16

Slot 5
PCIe Gen3 x4

Slot 6
PCIe Gen3 x16 (available only when a second CPU is installed)

Slot 7
PCIe Gen3 x4

Note: The PCIe x4 and PCIe x8 connectors are all open ended, allowing a PCIe x16 card to be seated in the slot

This HP Z8 G4 is configured with the Base Front I/O option and is equipped with four 5 Gb/s USB 3.1 Gen 1 Type-A ports (the left-most supports battery charging), a combo headset/microphone jack, and the option for an SD card reader.

Internal Slot 1 (CPU 1)
PCIe Gen3 x8 (always available, for M.2 storage)

Internal Slot 2 (CPU 2)
PCIe Gen3 x8 (available only when a second CPU is installed, for M.2 storage)

2 USB 2.0 ports available with a single 2x5 header
1 USB 2.0 port available with a 1x6 header
1 USB 3.0 and 1 USB 2.0 port available with a 2x6 header

Note: The 2x5 header can be converted to a standard USB 2.0 Type-A port using HP's Internal USB Bus Port Kit, which uses half of the 2x5 header. The 1x6 header can be converted to USB 2.0 Type-A using the same kit and uses 5 pin positions on the header, and the 2x6 header can also be converted to USB 2.0 Type-A using the same kit, which takes up half of the 2x6 header. Additionally, the USB 3.0 header is available with a single 20-pin shrouded connector for a USB media card reader.